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 PD-91796
PRELIMINARY
HFA40HF60C
Ultrafast, Soft Recovery Diode
VR = 600V VF = 1.56V Qrr = 270nC
HEXFRED
Features
TM
(ISOLATED BASE)
* Reduced RFI and EMI * Reduced Snubbing * Extensive Characterization of Recovery Parameters * Hermetic * Surface Mount
ANODE COMMON CATHODE ANODE
di(rec)M/dt = 345 A/s
Description
HEXFRED diodes are optimized to reduce losses and EMI/RFI in high frequency power conditioning systems. An extensive characterization of the recovery behavior for different values of current, temperature and di/dt simplifies the calculations of losses in the operating conditions. The softness of the recovery eliminates the need for a snubber in most applications. These devices are ideally suited for power converters, motors drives and other applications where switching losses are significant portion of the total losses.
TM
SMD-1
Absolute Maximum Ratings (per Leg)
Parameter
VR IF @ TC = 100C IFSM @ TC = 25C PD @ TC = 25C TJ TSTG D.C. Reverse Voltage Continuous Forward Current Single Pulse Forward Current Maximum Power Dissipation Operating Junction and Storage Temperature Range
Max.
600 30 150 63 -55 to +150
Units
V A W C
Thermal - Mechanical Characteristics
Parameter
RJC Junction-to-Case, Single Leg Conducting Weight
Typ.
-- 2.6
Max.
2.0 --
Units
C/W g
Note: D.C. = 50% rect. wave 1/2 sine wave, 60 Hz , P.W. = 8.33 ms
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1
8/20/98
HFA40HF60C
Electrical Characteristics (per Leg) @ TJ = 25C (unless otherwise specified)
Parameter
VBR VFM Cathode Anode Breakdown Voltage Max Forward Voltage
Min. Typ. Max. Units
600 -- -- -- -- -- -- -- -- -- -- -- -- -- 24 2.8 -- 1.56 1.92 1.51 10 1.0 36 -- V V A mA pF nH
Test Conditions
IR = 250A IF = 15A IF = 30A See Fig. 1 IF = 15A, TJ = 125C VR = VR Rated See Fig. 2 TJ = 125C, VR = 480V VR = 200V See Fig. 3 Measured from center of bond pad to end of anode bonding wire
IRM CT LS
Max Reverse Leakage Current Junction Capacitance Series Inductance
Dynamic Recovery Characteristics (per Leg) @ TJ = 25C (unless otherwise specified)
Parameter
trr1 trr2 IRRM1 IRRM2 Q rr1 Q rr2 di(rec)M/dt1 di(rec)M/dt2 Reverse Recovery Time Peak Recovery Current Reverse Recovery Charge Peak Rate of Fall of Recovery Current During tb
Min. Typ. Max. Units
-- -- -- -- -- -- -- -- 54 94 5.6 7.8 180 435 300 190 88 140 7.8 11.7 270 650 345 285 ns A nC A/s
Test Conditions
TJ = 25C See Fig. TJ = 125C 5 IF = 15A TJ = 25C See Fig. TJ = 125C 6 VR = 200V TJ = 25C See Fig. TJ = 125C 7 dif/dt = 200A/s T J = 25C See Fig. TJ = 125C 8
Case Outline and Dimensions -- SMD-1
Lead Assignments : 1 - Common Cathode 2, 3 - Anode
IR Case Style SMD-1 Dimensions in millimeters and (inches)
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HFA40HF60C
100 1000
R e v e rs e C u rre n t - I R ( A )
100 10 1 0.1 0.01 0.001 0.0001 0
TJ = 150C TJ = 125C
In sta n ta n e o u s F o rw a rd C u rre n t - I F (A )
TJ = 150C TJ = 125C TJ = 25C
10
TJ = 25C
200
400
600
R e ve rse V o lta g e - V R (V )
Fig. 2 - Typical Reverse Current vs. Reverse Voltage
J u n c tio n C a p a c ita n ce - C T (p F )
1000
A
TJ = 25 C
100
1 0.0 1.0 2.0 3.0 4.0
F o rw a rd V o lta g e D ro p - V FM (V )
Fig. 1 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
10 1 10 100 1000
R e v e rs e V o lta g e - V R (V )
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
10
Thermal Response (Z thJC )
1
D = 0.50 0.20 0.10 0.05 P DM SINGLE PULSE (THERMAL RESPONSE) t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJC + TC 0.0001 0.001 0.01 0.1 1
0.1
0.02 0.01
0.01 0.00001
t1 , Rectangular Pulse Duration (sec)
Fig. 4 - Maximum Thermal Impedance Zthjc Characteristics
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HFA40HF60C
150 100
120
I F = 30A IF = 15A I F = 7.5A
VR = 2 0 0 V T J = 1 2 5 C T J = 2 5 C
I F = 30A I F = 15A
Q RR -- (nS) ) TR R (n C
90
I IR R M - (A )
I F = 7.5A
10
60
30
VR = 2 0 0 V T J = 1 2 5 C T J = 2 5 C
0 100
d i f /d t - (A / s )
1000
1 100
1000
d i f /d t - (A / s)
Fig. 5 - Typical Reverse Recovery vs. dif/dt
Fig. 6 - Typical Recovery Current vs. dif/dt
1200
10000
I F = 30 A I F = 1 5A
900
VR = 2 0 0 V T J = 1 2 5 C T J = 2 5 C
I F = 7 .5A
d i(re c)M /d t - (A / s )
1000
Q R R - (n C )
600
100
300
I F = 7.5A I F = 15A I F = 30A
VR = 2 0 0 V T J = 1 2 5 C T J = 2 5 C
0 100
d i f /d t - (A / s )
1000
10 100
1000
d i f /d t - (A / s )
Fig. 7 - Typical Stored Charge vs. dif/dt
Fig. 8 - Typical di(rec)M/dt vs. dif/dt
4
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HFA40HF60C
3
IF
t rr ta tb
4
R E V E R S E R E C O V E R Y C IR C U IT
V R = 2 00 V
0 Q rr
2
I RRM
0.5 I R R M di(rec)M /dt
5
0.01 L = 70H D .U .T. D d if/d t A D JU S T G IR F P 2 50 S
1
0.75 I R R M di f /dt
4. Qrr - Area under curve defined by trr and IRRM trr X IRRM Qrr = 2 5. di(rec)M/dt - Peak rate of change of current during tb portion of trr
1. dif/dt - Rate of change of current through zero crossing 2. IRRM - Peak reverse recovery current 3. trr - Reverse recovery time measured from zero crossing point of negative going IF to point where a line passing through 0.75 IRRM and 0.50 IRRM extrapolated to zero current
Fig. 9 - Reverse Recovery Parameter Test Circuit
Fig. 10 - Reverse Recovery Waveform and Definitions
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan 171 Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 8/98
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